Silk PLA - Copper

Diameter: 1.75mm
Tolerance: ±0.03mm
Nozzle Temp: 190°C-220°C
Heated Bed Temp: 55-70°C
Printing Speed: 30-100mm/s
Peak Melting Temp: 155±5 ℃
MFR [g/10min]: 6
Specific Gravity [g/cm3]: 1.25
Elongation at Yield [%]: 3.2
Tensile Strength [MPa]: 35-40
Moisture absorption – 1 day[ppm]: ≤400